Additive Manufacturing (AM) is disruptive set of technologies which are bringing fundamental change in how manufacturing is carried out in many sectors due to its ability for mass customization. AM is enabler for digital manufacturing which has capability in producing products directly from design data by adding layers of material to obtain the final shape with minimal waste, supporting Industry 4.0. Ministry of Electronics and Information Technology (MeitY) has initiated a Centre of Excellence on Additive Manufacturing at Centre for Materials for Electronics Technology (C-MET), Pune in collaboration with Central Institute of Plastics Engineering & Technology (CIPET), Bhubaneswar. The objectives of the centre are to support Indian Additive Manufacturing Eco-system through focused and coordinated research, design and development in collaboration with 3 participating industries. The centre is expected to achieve self-sustenance and focus on developing indigenous materials and machine technologies for electronics manufacturing sector. In current phase of the project, 4 technologies with 4 different machines, 13 materials and 4 different electronics application products are slated to be developed. The project is also bringing opportunities for Indian companies to develop their own AM material and machine technologies for global market at much reduced R&D cost for any sector (not limited to electronics) such as aerospace, medical, automotive etc. The centre is also training manpower to support growth of AM economy in India.
| Number of Specialized Manpower Trained | Number of publications | Number of Proof of concept leading to field deployment | Number of IPRs filed | Number of Transfer of Technology (ToT) to industry | Number of industries engaged | Number of start-ups engaged | Revenue Generated for Self-sustenance (in Rs Lakhs) |
|---|---|---|---|---|---|---|---|
| 123 | 58 | 01 | 07 | 01 | 03 | 07 | 14 |
| No. | Technology available for ToT | Description |
|---|---|---|
| 1 | Metal/Ceramic and Semiconductor Powders | Nanoscale to micron size powders as per the need |
| 2 | Metal-polymer, ceramic-polymer and semiconductor-polymer composite Filament | Metal-polymer, ceramic-polymer and semiconductor-polymer composite Filaments of 1.75mm diameter and >10m length |
| 3 | Metal based conductor in and Li-ion battery, anode and cathode inks | Metal organic binder ink for printing conducting tracks. Li-ion battery anode and cathode inks for printing the rechargeable battery. |
| 4 | 3D printed antenna for navigation | Ceramic-Polymer composite based and ceramic based antenna |
| 5 | 3D printed rechargeable Li-ion Battery | Rechargeable Li-ion battery half cell and full cell (coin) and pouch cell |
| 6 | LTCC ceramic powder (Dielectric) | Low Temperature Co-Fired Ceramics (LTCC) packaging technology uses dielectric materials in the layers of its multilayer ceramic packages or PCBs |
| 7 | Silver metal powder (Conductor) | Silver is used as a conducting material in printed circuit boards (PCBs) |
| 8 | Palladium metal powder (Conductor) | Palladium is used along with silver as conductor tracks and pads especially for outer metallization material in printed circuit boards (PCBs) |
| 9 | Photo-curable resin | Photo-curable resins are used in 3D printing to create objects by curing UV-sensitive resins in layers with a light source |
| 10 | LTCC - Photocurable resin composite | The composite can be used for 3D printing of base layers of LTCC packages |
| 11 | Ag - Photocurable resin composite | The composite can be used for 3D printing of external conductor tracks and pads of LTCC packages |
| 12 | Ag-Pd - Photocurable resin composite | The composite can be used for 3D printing of conductor tracks and pads of LTCC packages |
| 13 | Sacrificial - Photocurable resin composite | The composite can be used for 3D printing of sacrificial layer/fill for LTCC packages |
(Chief Investigator-I)
Scientist 'E'
C-MET, Pune
Phone No.: 9890909949
(Chief Investigator-II)
Scientist 'E'
C-MET, Pune
Phone No.: 9890301373
(Chief Investigator-II)
Director & Head (Principal Scientist),
CIPET : SARP - LARPM - Bhubaneshwar
Phone No.: 9692895995